in the present invention when detecting a fault by the inspection after the solder balls supplied onto the substrate surface , to provide a solder ball test efficiently at low cost repair device which makes it possible to reliably perform the repair of the defect. ; state of the solder ball mounted on the electrode pads of the substrate in the present invention for this purpose examines, in a solder ball check repair device with a dispenser for supplying a solder ball can be taken to the electrode pad is defective is detected, can take the dispenser 87, the suction nozzle for holding the solder balls 24 (90 ), a suction nozzle 90 and the through-hole 92 formed in the end portion solder balls (the suction nozzle (90 through holes of 92) moves freely inside the mandrel (91) and a mandrel (91) 24) in the state in which pressed against the electrode pad 120, the suction nozzle 90 was set to a drive mechanism for moving in a direction from the solder ball (24).
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