首页> 外国专利> GRINDING WHEEL FOR CORRECTING SURFACE PLATE, POLISHING DEVICE FOR CORRECTING SURFACE PLATE, AND METHOD FOR CORRECTING POLISHING SURFACE PLATE

GRINDING WHEEL FOR CORRECTING SURFACE PLATE, POLISHING DEVICE FOR CORRECTING SURFACE PLATE, AND METHOD FOR CORRECTING POLISHING SURFACE PLATE

机译:用于修整表面板的研磨轮,用于修整表面板的抛光装置以及用于修整表面板的方法

摘要

PROBLEM TO BE SOLVED: To obtain a workpiece with favorable surface roughness by sufficiently holding abrasive grains in an opened granular graphite holes existing at a surface of the surface plate, capable of obtaining a stable polishing force by an increase of the holding force and transferring a fine surface of the surface plate to a polishing workpiece when actually polishing the polishing workpiece by using free abrasive grains.;SOLUTION: This polishing device corrects and polishes a polishing surface plate by disposing carriers for correcting the surface plate having holes for holding grinding wheels for correcting the surface plate on the polishing surface plate, holding the grinding wheels in the holes of the carriers, rotating each of the polishing surface plate and the carrier and supplying free abrasive grains to the polishing surface plate. The shape of the grinding wheel disposed in the hole of the carrier has a fan-shape of 180-90° at a circular center angle.;COPYRIGHT: (C)2010,JPO&INPIT
机译:解决的问题:通过将磨料颗粒充分地保持在存在于面板表面的开放的粒状石墨孔中,从而获得具有良好的表面粗糙度的工件,该工件能够通过增加保持力而获得稳定的抛光力并传递当使用自由磨料砂轮实际抛光抛光工件时,将抛光平台的表面细化为抛光工件。校正抛光平台上的平台,将砂轮保持在载体的孔中,旋转抛光平台和载体中的每一个,并向抛光平台提供自由的磨料颗粒。设置在托架的孔中的砂轮的形状为180°至90°的扇形。版权为:(C)2010,JPO&INPIT

著录项

  • 公开/公告号JP2010194704A

    专利类型

  • 公开/公告日2010-09-09

    原文格式PDF

  • 申请/专利权人 SHINANO DENKI SEIREN KK;

    申请/专利号JP20090170336

  • 申请日2009-07-21

  • 分类号B24B53/12;B24B53/02;B24B53/013;B24D3/32;B24D7/06;

  • 国家 JP

  • 入库时间 2022-08-21 19:04:17

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