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Production process and the IC chip containing sheet manufacturing method of the thread, and the thread and the IC chip containing sheet produced by these

机译:线的制造工序和包含IC芯片的片材的制造方法,以及由其制造的线和包含IC芯片的片材

摘要

PPROBLEM TO BE SOLVED: To prevent an adhesive from adhering to a chip installing head for installing an IC chip when the IC chip is bonded onto a sheet board through the adhesive. PSOLUTION: Under the condition that a hot melt layer 30 laminated onto a resin sheet 2, which is turned into a strip-like resin layer by being cut out, is kept under being fused, the IC chip 10 is jetted against the hot melt layer 30 so as to embed the IC chip 10 in the fused hot melt layer 30 by the jetting force of the IC chip 10. PCOPYRIGHT: (C)2005,JPO&NCIPI
机译:

要解决的问题:当通过粘合剂将IC芯片粘合到薄板上时,为了防止粘合剂粘附到用于安装IC芯片的芯片安装头上。

解决方案:在层压到树脂片2上的热熔层30保持熔融状态下,将其切成条状树脂层,将IC芯片10喷射在其上。热熔层30,以便通过IC芯片10的喷射力将IC芯片10嵌入熔融的热熔层30中。

版权所有:(C)2005,JPO&NCIPI

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