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Architecture and Physical Implementation of a Third Generation 65 nm, 16 Core, 32 Thread Chip-Multithreading SPARC Processor

机译:第三代65 nm,16核,32线程芯片多线程SPARC处理器的体系结构和物理实现

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This third-generation Chip-Multithreading (CMT) SPARC processor consists of 16 cores with shared memory architecture and supports a total of 32 main threads plus 32 scout threads. It is targeted for high-performance servers, and is optimized for both single- and multi-threaded applications. The 396 mm2 chip is fabricated in an 11 metal layer 65-nm CMOS process and operates at a nominal frequency of 2.3 GHz, consuming a maximum power of 250 W at 1.2 V. This paper provides an overview of the architectural highlights and describes the physical implementation challenges and solutions including circuit innovations in memory arrays, register files, and floating-point hardware that boost the performance and circuit robustness with low area overhead.
机译:这种第三代芯片多线程(CMT)SPARC处理器由16个具有共享内存体系结构的内核组成,并支持总共32个主线程和32个scout线程。它针对高性能服务器,并且针对单线程和多线程应用程序进行了优化。 396 mm2芯片采用11金属层65 nm CMOS工艺制造,工作在2.3 GHz的标称频率下,在1.2 V时消耗的最大功率为250W。本文概述了架构亮点并描述了物理特性。实施挑战和解决方案,包括存储器阵列,寄存器文件和浮点硬件的电路创新,这些技术可在低面积开销的情况下提高性能和电路鲁棒性。

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