Semiconductor package lead/read alignment device and semiconductor package lead/read alignment manner

摘要

P To align the distance between the leads of an FPC bent along a semiconductor chip to prescribed dimensions easily and precisely and when forming a BGA in which the FPC is combined with the semiconductor chip. PSOLUTION: While air in an aligning tool 51 is being sucked by a vacuum pump 53, each solder ball 36 welded to respective lead sections 25a and 25b of a semiconductor package 20 is aligned to each prescribed through hole 51b in a lid section 51of a the tool 51, thus rocking the semiconductor package 20 itself. Then, since the inside of the tool 51 is being sucked and each solder ball 36 enters each through hole 51b and is fitted. When the degree of vacuum in a vacuum gauge 52 reaches a preset value in this state and it is understood that the solder ball 36 has been fitted and fixed appropriately. In this state and a planar reinforcing member 33 is adhered to a center reinforcing member 35, thus adhering and fixing respective lead sections 25a and 25b. PCOPYRIGHT: (C)2006 and JPO& NCIPI