The pushing overpowering with the sticking roller which it convolutes moves the adhesion tape which is drawn out from

摘要

PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive tape sticking method and a pressure-sensitive adhesive tape sticking apparatus of semiconductor wafers capable of uniformly sticking a pressure-sensitive adhesive tape to a semiconductor wafer without applying unneeded tension when pressing the pressure-sensitive adhesive tape delivered from a tape supply section by a rolling, sticking roller for sticking along the surface of the semiconductor wafer.;SOLUTION: The rolling position of the sticking roller 23 is detected by utilizing a rotary sensor 36 from the amount of rotation of a motor 25 in linking with the rolling of the sticking roller 23. A control unit 37 changes and controls the amount of forced feed of the pressure-sensitive adhesive tape T by utilizing the detection result, and maintains the tension of the pressure-sensitive adhesive tape T in sticking operation within a set range.;COPYRIGHT: (C)2007,JPO&INPIT