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Pattern forming method, the pattern forming multiple development for the positive resist composition used in the method, the negative developer for developing solution used in the pattern forming method and a negative developing rinse solution used in the pattern forming method
Pattern forming method, the pattern forming multiple development for the positive resist composition used in the method, the negative developer for developing solution used in the pattern forming method and a negative developing rinse solution used in the pattern forming method
A pattern forming method, including: (A) coating a substrate with a positive resist composition of which solubility in a positive developer increases and solubility in a negative developer decreases upon irradiation with actinic rays or radiation, so as to form a resist film; (B) exposing the resist film; and (D) developing the resist film with a negative developer; a positive resist composition for multiple development used in the method; a developer for use in the method; and a rinsing solution for negative development used in the method.
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