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Die/di attaching paste and semiconductor equipment
Die/di attaching paste and semiconductor equipment
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机译:芯片/芯片贴合膏和半导体设备
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摘要
To provide a semiconductor adhering paste that is superior in adhesion, fast-hardening and reliability. SOLUTION: This die-attach paste contains as indispensable components, (A) a hydrocarbon, having a molecular weight of 500 or higher and 5,000 or lower and moreover having at least one double bond in the molecule and or its derivative; (B) a (meth) acrylic monomer having at least one fluorine element in a molecule; (C) a radical polymerization catalyser; and (D) a filler.
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