首页>
外国专利>
Interconnect Structures, Methods for Fabricating Interconnect Structures, and Design Structures for a Radiofrequency Integrated Circuit
Interconnect Structures, Methods for Fabricating Interconnect Structures, and Design Structures for a Radiofrequency Integrated Circuit
展开▼
机译:互连结构,制造互连结构的方法和射频集成电路的设计结构
展开▼
页面导航
摘要
著录项
相似文献
摘要
Interconnect structures that include a passive element, such as a thin film resistor or a metal-insulator-metal (MIM) capacitor, methods for fabricating an interconnect structure that includes a passive element, and design structures embodied in a machine readable medium for designing, manufacturing, or testing an integrated circuit, such as a radiofrequency integrated circuit. A top surface of a dielectric layer is recessed relative to a top surface of a conductive feature in the dielectric layer. The passive element is formed on the recessed top surface of the dielectric layer and includes a layer of a conductive material that is coplanar with, or below, the top surface of the conductive feature.
展开▼