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Interconnect structures, methods for fabricating interconnect structures, and design structures for a radiofrequency integrated circuit
Interconnect structures, methods for fabricating interconnect structures, and design structures for a radiofrequency integrated circuit
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机译:互连结构,用于制造互连结构的方法以及用于射频集成电路的设计结构
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摘要
Interconnect structures that include a passive element, such as a thin film resistor or a metal-insulator-metal (MIM) capacitor, methods for fabricating an interconnect structure that includes a passive element, and design structures embodied in a machine readable medium for designing, manufacturing, or testing an integrated circuit, such as a radiofrequency integrated circuit. A top surface of a dielectric layer is recessed relative to a top surface of a conductive feature in the dielectric layer. The passive element is formed on the recessed top surface of the dielectric layer and includes a layer of a conductive material that is coplanar with, or below, the top surface of the conductive feature.
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