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Methods and Apparatus for Improved Thermal Performance and Electromagnetic Interference (EMI) Shielding in Leadframe Integrated Circuit (IC) Packages
Methods and Apparatus for Improved Thermal Performance and Electromagnetic Interference (EMI) Shielding in Leadframe Integrated Circuit (IC) Packages
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机译:引线框集成电路(IC)封装中改善热性能和电磁干扰(EMI)屏蔽的方法和设备
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摘要
A method of assembling an IC device package is provided. A leadframe is formed. At least one IC die is attached to a die attach pad portion of the leadframe. Wire bonds are coupled between the IC die and the leadframe. A cap is attached to the leadframe. A second surface of the cap includes a cavity formed therein. The cap and leadframe form an enclosure structure that substantially encloses the at least one IC die. An encapsulating material is applied to encapsulate at least the IC die. A perimeter support ring portion of the leadframe is trimmed.
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