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METALLIZATION SYSTEM OF A SEMICONDUCTOR DEVICE INCLUDING METAL PILLARS HAVING A REDUCED DIAMETER AT THE BOTTOM
METALLIZATION SYSTEM OF A SEMICONDUCTOR DEVICE INCLUDING METAL PILLARS HAVING A REDUCED DIAMETER AT THE BOTTOM
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机译:底部具有减小的直径的包括金属支柱的半导体装置的金属化系统
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摘要
In a metallization system of a complex semiconductor device, metal pillars, such as copper pillars, may be formed in a nail-like configuration in order to reduce the maximum mechanical stress acting on the metallization system while providing a required contact surface for connecting to the package substrate. The nail-like configuration may be obtained on the basis of appropriately configured resist masks.
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