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Phase-changeable memory devices including phase-changeable materials on silicon nitride layers

机译:相变存储器件,包括氮化硅层上的相变材料

摘要

A phase-changeable memory device includes a substrate having a contact region on an upper surface thereof. An insulating interlayer on the substrate has an opening therein, and a lower electrode is formed in the opening. The lower electrode has a nitrided surface portion and is in electrical contact with the contact region of the substrate. A phase-changeable material layer pattern is on the lower electrode, and an upper electrode is on the phase-changeable material layer pattern. The insulating interlayer may have a nitrided surface portion and the phase-changeable material layer may be at least partially on the nitrided surface portion of the insulating interlayer. Methods of forming phase-changeable memory devices are also disclosed.
机译:相变存储器件包括在其上表面上具有接触区域的基板。基板上的绝缘夹层在其中具有开口,并且在开口中形成下部电极。下电极具有氮化的表面部分,并且与基板的接触区域电接触。相变材料层图案在下电极上,而上电极在相变材料层图案上。绝缘夹层可以具有氮化表面部分,并且相变材料层可以至少部分地在绝缘夹层的氮化表面部分上。还公开了形成相变存储器件的方法。

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