Semiconductor device having a frame portion and an opening portion with mountable semiconductor chips therein

摘要

A semiconductor chip includes a semiconductor substrate having an opening portion and a frame portion defining a periphery of the opening portion. At least one electric element is provided on the frame portion, and has at least one electrode terminal. A first insulation film is formed on the frame portion so that the electrode terminal is partially exposed at the first insulation film to form a plurality of electrode pads.