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Method for reducing microloading in etching high aspect ratio structures
Method for reducing microloading in etching high aspect ratio structures
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机译:在蚀刻高深宽比结构中减少微负载的方法
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摘要
A method for etching features of different aspect ratios in a conductive layer is provided. The method comprises: depositing over the conductive layer with an aspect ratio dependent deposition; etching features into the conductive layer with an aspect ratio dependent etching of the conductive layer; and repeating the depositing and the etching at least once.
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