SUBSTRATE WARPAGE PREDICTING METHOD, SUBSTRATE WARPAGE PREDICTING SYSTEM, AND SUBSTRATE WARPAGE PREDICTING PROGRAM

摘要

Disclosed is a substrate warpage predicting system, which improves a warpage predicting precision of an entire substrate and predicts a local deformation to be caused by a wiring pattern, highly precisely.  The substrate warpage predicting system: fetches analytical data containing at least the wiring pattern of a multi-layered printed-circuit board, the modulus of elasticity, the coefficient of linear expansion and the thickness of each layer, and temperature profile data; creates a structure model by meshing each layer of the multi-layered printed-circuit board on the basis of the analytical data fetched; extracts an unmatched pair layer, which is a pair of a wiring layer and a resin layer of the printed-circuit board and has the nodes of elements not coincident but unmatched in a junction face between the wiring layer and the resin layer; calculates the equivalent modulus of elasticity of the wiring layer containing a conductor area and a resin area, for the unmatched pair layer extracted; calculates warpage variation data indicating the warpage change of each junction face on the basis of the calculated equivalent modulus of elasticity; and calculates the warpage of the multi-layered printed-circuit board on the basis of the structure model, the warpage variation data and a temperature change.