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METHOD AND DEVICE FOR FABRICATING BONDING WIRES ON THE BASIS OF MICROELECTRONIC MANUFACTURING TECHNIQUES
METHOD AND DEVICE FOR FABRICATING BONDING WIRES ON THE BASIS OF MICROELECTRONIC MANUFACTURING TECHNIQUES
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机译:基于微电子制造技术制造接合线的方法和装置
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摘要
Bonding wires (252A) for sophisticated bonding applications may be efficiently formed on the basis of a corresponding template device (200) that may be formed on the basis of semiconductor material (201), such as silicon, in combination with associated fabrication techniques, such as lithography and etch techniques. Hence, any appropriate diameter and cross-sectional shape may be obtained with a high degree of accuracy and reliability.
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