METHOD AND DEVICE FOR FABRICATING BONDING WIRES ON THE BASIS OF MICROELECTRONIC MANUFACTURING TECHNIQUES

摘要

sophisticated application of bonding for a bonding wire (252A) to the corresponding template device (200 ) based on the bar that can be formed effectively , the template device 200 , combined with the associated manufacturing techniques such as lithography and etching techniques, such as silicon can be formed on the basis of the semiconductor material ( 201) . Thus , any suitable diameter and cross-sectional shape can be obtained with high accuracy and reliability . ;