首页> 外国专利> BAFFLE PLATE AND A SUBSTRATE PROCESSING DEVICE, IMPROVING UNIFORMITY OF A SUBSTRATE PROCESS

BAFFLE PLATE AND A SUBSTRATE PROCESSING DEVICE, IMPROVING UNIFORMITY OF A SUBSTRATE PROCESS

机译:挡板和基板处理装置,提高基板处理的均匀性

摘要

PURPOSE: A baffle plate and a substrate processing device are provided to prevent the lowering of a process speed in a circumference of a semiconductor wafer by controlling a process state of a peripheral part of the semiconductor wafer.;CONSTITUTION: A baffle plate(5) is arranged around a substrate mounting table(3) in a process chamber(2). The baffle plate has a plurality of exhaust holes. The gas is exhausted from the process chamber through a plurality of exhaust holes. The baffle plate has a stack structure of the plurality of plate-shaped units. The baffle plate has the supply path of the pressure control gas for controlling the pressure inside the process chamber. The pressure control gas is the argon gas or nitrogen gas.;COPYRIGHT KIPO 2010
机译:目的:提供一种挡板和一种基板处理装置,以通过控制半导体晶片外围部分的处理状态来防止半导体晶片周围的处理速度降低。组成:挡板(5)在处理室(2)中的基板载置台(3)的周围配置有基板。挡板具有多个排气孔。气体通过多个排气孔从处理室排出。挡板具有多个板状单元的堆叠结构。挡板具有用于控制处理室内的压力的压力控制气体的供应路径。压力控制气体是氩气或氮气。; COPYRIGHT KIPO 2010

著录项

  • 公开/公告号KR20090133099A

    专利类型

  • 公开/公告日2009-12-31

    原文格式PDF

  • 申请/专利权人 TOKYO ELECTRON LIMITED;

    申请/专利号KR20090055946

  • 发明设计人 IIZUKA HACHISHIRO;

    申请日2009-06-23

  • 分类号H01L21/205;H01L21/3065;

  • 国家 KR

  • 入库时间 2022-08-21 18:33:47

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