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e-beam projection lithography for the emitter and its working methods and manufacturing methods

机译:发射极的电子束投影光刻及其工作方法和制造方法

摘要

Electron beam projection lithography for the emitter and its manufacturing method and operating method are disclosed. The disclosed emitter, is formed on the back surface of the photoconductor substrate and the photoconductor front insulating layer and, formed on the insulating layer, the entire relatively patterned to have a thin portion and a thick portion gate electrode layer and a photoconductive substrate formed on a substrate transparent It is provided with a base electrode layer made of a conductive material. In the emitter, when converting the voltage between the base electrode layer and the gate electrode layer is applied and the side of the back surface of the emitter light by irradiating light to a portion of the entire substrate conductor a portion of the photoconductor layer substrate, of the photoconductor substrate optical the electrons are emitted only partially investigated. This according to the present invention, it is possible from the emitter part of the electron emission, a full-scale after the first patterned partial correction or compensation is possible.
机译:公开了一种用于发射器的电子束投影光刻及其制造方法和操作方法。所公开的发射极形成在光电导体基板的背面和光电导体前绝缘层上,并且形成在绝缘层上,整个相对图案化以具有薄的部分和厚的部分的栅电极层以及在其上形成的光电导基板透明的基板具备由导电材料构成的基底电极层。在发射极中,当通过在基体电极层和栅电极层之间施加电压并且通过将光照射到整个基板导体的一部分,以及光导体层基板的一部分上而对发射极的背面侧施加光时,在光电导基片中,仅部分研究了电子的发射。根据本发明,可以从电子发射的发射器部分在第一次图案化的部分校正或补偿之后实现满量程。

著录项

  • 公开/公告号KR100928965B1

    专利类型

  • 公开/公告日2009-11-26

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20030070990

  • 发明设计人 유인경;문창욱;최창훈;

    申请日2003-10-13

  • 分类号H01L21/027;

  • 国家 KR

  • 入库时间 2022-08-21 18:33:45

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