首页> 外国专利> MANUFACTURING METHOD OF CIRCUIT BOARD FOR CAMERA MODULE, CIRCUIT BOARD FOR CAMERA MODULE MANUFACTURED BY THE METHOD, AND BOARD TRAY FOR MANUFACTURING OF THE CIRCUIT BOARD

MANUFACTURING METHOD OF CIRCUIT BOARD FOR CAMERA MODULE, CIRCUIT BOARD FOR CAMERA MODULE MANUFACTURED BY THE METHOD, AND BOARD TRAY FOR MANUFACTURING OF THE CIRCUIT BOARD

机译:照相机模块电路板的制造方法,用该方法制造的照相机模块的电路板以及电路板的制造板

摘要

PURPOSE: A manufacturing method of a circuit board for a camera module and a circuit board tray for the method are provided to form a notch structure when separating a circuit board off the tray. CONSTITUTION: A blank(33) passing through a tray forms each side of a circuit board for a camera module. A bridge(40) is provided between blanks on both sides of the circuit board and connects a dummy region to the circuit board. The dummy region is the rest part of the tray except for the circuit board area. A hole(42) is formed through the bridge.
机译:目的:提供一种用于照相机模块的电路板的制造方法和用于该方法的电路板托盘,以在将电路板从托盘分离时形成切口结构。组成:穿过托盘的毛坯(33)形成了相机模块电路板的每一侧。桥(40)设置在电路板两侧上的坯料之间,并将虚设区域连接到电路板。虚拟区域是托盘的其余部分,电路板区域除外。穿过桥形成有孔(42)。

著录项

  • 公开/公告号KR20100018770A

    专利类型

  • 公开/公告日2010-02-18

    原文格式PDF

  • 申请/专利权人 SAMSUNG ELECTRO-MECHANICS CO. LTD.;

    申请/专利号KR20080077429

  • 发明设计人 LEE JAE SUN;

    申请日2008-08-07

  • 分类号H04N5/225;

  • 国家 KR

  • 入库时间 2022-08-21 18:33:20

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