LIQUID EPOXY RESIN COMPOSITION FOR AN UNDERFILLING SEMICONDUCTOR DEVICE FOR IMPROVING THERMAL AND MECHANICAL RELIABILITY OF A SEMICONDUCTOR PACKAGE AND A SEMICONDUCTOR DEVICE USING THE SAME

摘要

PURPOSE: A liquid epoxy resin composition for an underfilling semiconductor device is provided to be used for an underfilling semiconductor device requiring high reliability and excellent rework.;CONSTITUTION: A liquid epoxy resin composition for an underfilling semiconductor device comprises an epoxy resin, a hardener and curing accelerator. The epoxy resin is a bisphenol-epoxy resin and the hardener is a thiol compound. The liquid epoxy resin composition further comprises one or more compounds selected from a phenoxy resin, an epoxy resin represented by chemical formula 1, and an epoxy resin represented by chemical formula 2.;COPYRIGHT KIPO 2010