首页> 外国专利> METHOD FOR ETCHING A CARBON LAYER AND THE METHOD FOR FORMING A CONTACT HOLE USING THE SAME, CAPABLE OF REDUCING A THRESHOLD LINE WIDTH OF THE CONTACT HOLE

METHOD FOR ETCHING A CARBON LAYER AND THE METHOD FOR FORMING A CONTACT HOLE USING THE SAME, CAPABLE OF REDUCING A THRESHOLD LINE WIDTH OF THE CONTACT HOLE

机译:刻蚀碳层的方法和使用相同方法形成接触孔的方法,能够减小接触孔的阈值线宽度

摘要

PURPOSE: A method for etching a carbon layer and the method for forming a contact hole using the same are provided to prevent the deterioration of a threshold line width of openings using an etch gas with a xenon gas and an oxygen gas.;CONSTITUTION: A capping film pattern is formed on a carbon layer(S120). The carbon layer is plasma-etched using an etch gas(S130). The etch gas includes oxygen and xenon. The carbon layer is exposed by the capping film pattern. The etch gas includes a xenon gas or mixture of the xenon and argon with the oxygen gas.;COPYRIGHT KIPO 2010
机译:目的:提供一种用于蚀刻碳层的方法和一种用于形成碳层的接触孔的方法,以防止使用具有氙气和氧气的蚀刻气体来降低开口的阈值线宽。在碳层上形成覆盖膜图案(S120)。使用蚀刻气体对碳层进行等离子体蚀刻(S130)。蚀刻气体包括氧气和氙气。碳层被覆盖膜图案暴露。蚀刻气体包括氙气或氙气和氩气与氧气的混合物。; COPYRIGHT KIPO 2010

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