Contact hole size reducing methods by using water-soluble organic over-coating material (WASOOM) as a barrier layer toward 0.15um contact hle; resist flow technique I

摘要

In our epxeriment for 0.15um contact hel, we used Water-soluble organic overcoating material (WASOOM) as a barrier layer. Since WASOOM is water soluble, after baking for resist flow, water rinse will remove it completely. The key point of resist flow technique is to reduce overhang, it other workds, reducting thermal stress at the top and bottom of resist pattern by WASOOM can lead to well-controlled DICD. Since WASOOM is water soluble and very compatible with resist, during resist flow, it is assumed that it will be acting as a barrier layer so that overhang should be reduced. Inthis paper we will describe below 0.2um contact hole pattern without overhang profile, well controlled DICD and fine etch profile. And also 0.15um contact hole patterning method will be described with half tone + resist flow by WASOOM. And also we will describe the applicatiion of SOG (Spin On Glass) for removing top flare after resist baking.