SEMICONDUCTOR CHIP, A METHOD FOR MANUFACTURING THE SEMICONDUCTOR CHIP, AND A STACK PACKAGE, CAPABLE OF PROTECTING THE BACK SIDE OF A WAFER IN A CLEAVING PROCESS

摘要

PURPOSE: A semiconductor chip, a method for manufacturing the semiconductor chip, and a stack package are provided to prevent the crack on the back side of a wafer by controlling the depth of a contact plug which is formed in a wafer.;CONSTITUTION: A hydrogen impurity(111) is inserted into a wafer(110). A semiconductor device(120) is formed on the wafer. A metal is electrically connected to the semiconductor device. A contact plug(162) passes through an insulating layer which is formed on the wafer. A wiring layer(170) is electrically connected to the contact plug and the metal.;COPYRIGHT KIPO 2010