首页> 外国专利> METHOD FOR FORMING A SILICON NITRIDE FILM WITH AN IMPROVED UV TRANSMISSION PROPERTY, CAPABLE OF REDUCING THE EQUIVALENT OF SILICON IN THE SILICON NITRIDE FILM, AND A SEMICONDUCTOR DEVICE COMPRISING THE SAME

METHOD FOR FORMING A SILICON NITRIDE FILM WITH AN IMPROVED UV TRANSMISSION PROPERTY, CAPABLE OF REDUCING THE EQUIVALENT OF SILICON IN THE SILICON NITRIDE FILM, AND A SEMICONDUCTOR DEVICE COMPRISING THE SAME

机译:形成具有改善的紫外线透射性能,能够减少硅氮化物中的硅当量的硅氮化物膜的方法以及包括该硅氮化物膜的半导体器件

摘要

PURPOSE: A method for forming a silicon nitride film with an improved UV transmission property and a semiconductor device comprising the same are provided to reduce the refractive index and the absorbent index of the semiconductor device without a silicon nitroxide film by changing the chemical composition of the silicon nitride film.;CONSTITUTION: A silicon nitride film is formed by injecting a precursor gas containing silicon source and a precursor gas containing nitrogen source into a plasma chamber. Under a condition which RF power is between 400 to 600W, nitrogen gas and hydrogen gas are injected in order to reduce the equivalent of silicon in the silicon nitride film. A process for forming the silicon nitride film and a process for reducing the equivalent of the silicon in the silicon nitride film are successively repeated.;COPYRIGHT KIPO 2010
机译:目的:提供一种形成具有改善的紫外线透射特性的氮化硅膜的方法和包括该方法的半导体器件,以通过改变氮化硅膜的化学成分来降低没有氮氧化硅膜的半导体器件的折射率和吸收指数。组成:通过将包含硅源的前驱物气体和包含氮源的前驱物气体注入等离子腔室来形成氮化硅膜。在RF功率在400至600W之间的条件下,注入氮气和氢气以减少氮化硅膜中的硅的当量。依次重复进行氮化硅膜的形成过程和减少氮化硅膜中硅的当量的过程。; COPYRIGHT KIPO 2010

著录项

  • 公开/公告号KR20100074491A

    专利类型

  • 公开/公告日2010-07-02

    原文格式PDF

  • 申请/专利权人 DONGBU HITEK CO. LTD.;

    申请/专利号KR20080132948

  • 发明设计人 KWON SOON GYU;

    申请日2008-12-24

  • 分类号H01L21/205;H01L21/8247;

  • 国家 KR

  • 入库时间 2022-08-21 18:32:25

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