首页> 外国专利> MIM CAPACITOR CAPABLE OF REDUCING THE LEVEL DIFFERENCE GENERATING IN A MIM CAPACITOR MANUFACTURE PROCESS, AND A MANUFACTURING METHOD THEREOF

MIM CAPACITOR CAPABLE OF REDUCING THE LEVEL DIFFERENCE GENERATING IN A MIM CAPACITOR MANUFACTURE PROCESS, AND A MANUFACTURING METHOD THEREOF

机译:可减少在mim电容器制造过程中产生的水平差的mim电容器及其制造方法

摘要

PURPOSE: A MIM capacitor and a manufacturing method thereof are provided to uniformly keep the level difference of the following superstructure by manufacturing the MIM capacitor by filling a dielectric layer and a top metal line to the down metal wiring.;CONSTITUTION: A bottom metal layer(300) is formed on a semiconductor substrate. The formed bottom metal layer is patterned and a trench is formed in MIM capacitor defined area. A buried type MIM capacitor is formed by forming a dielectric layer and an upper metal layer into a buried type inside the formed trench. An plurality of metal wiring layers(310a,312a,312b) electrically connected on the top of the formed imbedded MIM capacitor is formed. A polishing stop layer is formed on the top of the formed bottom metal clad after forming the bottom metal layer.;COPYRIGHT KIPO 2010
机译:目的:提供一种MIM电容器及其制造方法,以通过将介电层和顶部金属线填充到下层金属布线中来制造MIM电容器,从而均匀地保持随后的上部结构的水平差;组成:底部金属层(300)形成在半导体衬底上。对形成的底部金属层进行构图,并在MIM电容器定义的区域中形成沟槽。通过在形成的沟槽内将电介质层和上部金属层形成为掩埋型来形成掩埋型MIM电容器。形成电连接在所形成的嵌入式MIM电容器的顶部上的多个金属布线层(310a,312a,312b)。在形成底部金属层之后,在形成的底部金属覆层的顶部上形成抛光停止层。; COPYRIGHT KIPO 2010

著录项

  • 公开/公告号KR20100079179A

    专利类型

  • 公开/公告日2010-07-08

    原文格式PDF

  • 申请/专利权人 DONGBU HITEK CO. LTD.;

    申请/专利号KR20080137595

  • 发明设计人 SONG JUN WOO;

    申请日2008-12-30

  • 分类号H01L27/108;H01L21/8242;

  • 国家 KR

  • 入库时间 2022-08-21 18:32:18

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号