首页> 外国专利> SILICON CARBIDE SUBSTRATE, AN EPITAXIAL WAFER, AND A METHOD FOR MANUFACTURING THE SILICON CARBIDE SUBSTRATE, CAPABLE OF EFFICIENTLY REDUCING RESIDUE

SILICON CARBIDE SUBSTRATE, AN EPITAXIAL WAFER, AND A METHOD FOR MANUFACTURING THE SILICON CARBIDE SUBSTRATE, CAPABLE OF EFFICIENTLY REDUCING RESIDUE

机译:可有效减少残留物的碳化硅基质,外延晶片和制造碳化硅基质的方法

摘要

PURPOSE: A silicon carbide substrate, an epitaxial wafer, and a method for manufacturing the silicon carbide substrate are provided to efficiently reduce the number of residues attached on a main surface by performing an etching process with the gas containing hydrogen or hydrogen chloride.;CONSTITUTION: An underlying substrate with a main surface made of silicon carbide is prepared. The main surface is cleaned with a first alkaline solution and a second alkaline solution. A silicon carbide substrate(10) is formed through a cleaning process. The number of residues on the main surface of the silicon carbide substrate is between 0.2 to 200.;COPYRIGHT KIPO 2010
机译:目的:提供一种碳化硅衬底,外延晶片以及一种制造碳化硅衬底的方法,以通过对包含氢或氯化氢的气体进行蚀刻工艺来有效地减少附着在主表面上的残留物的数量。 :制备具有由碳化硅制成的主表面的下层基板。主表面用第一碱性溶液和第二碱性溶液清洁。通过清洁工艺形成碳化硅衬底(10)。碳化硅衬底主表面上的残留物数量在0.2到200之间;; COPYRIGHT KIPO 2010

著录项

  • 公开/公告号KR20100083716A

    专利类型

  • 公开/公告日2010-07-22

    原文格式PDF

  • 申请/专利权人 SUMITOMO ELECTRIC INDUSTRIES LTD.;

    申请/专利号KR20100001648

  • 发明设计人 HARADA SHIN;SASAKI MAKOTO;

    申请日2010-01-08

  • 分类号H01L21/302;H01L21/20;

  • 国家 KR

  • 入库时间 2022-08-21 18:32:12

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