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Method for manufacturing silicon carbide single crystal substrate for epitaxial silicon carbide wafer and silicon carbide single crystal substrate for epitaxial silicon carbide wafer
Method for manufacturing silicon carbide single crystal substrate for epitaxial silicon carbide wafer and silicon carbide single crystal substrate for epitaxial silicon carbide wafer
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机译:用于外延碳化硅晶片的碳化硅单晶衬底的制造方法和用于外延碳化硅晶片的碳化硅单晶衬底
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摘要
Provided is a method for manufacturing an SiC single-crystal substrate making it possible to obtain an epitaxial SiC wafer provided with a high-quality SiC single-crystal thin film devoid of surface defects, etc. Also provided is said SiC single-crystal substrate. A method for manufacturing an SiC single-crystal substrate for an epitaxial SiC wafer having a high-quality SiC single-crystal thin film devoid of surface defects, etc., wherein the surface of the SiC single-crystal substrate is polished using chemical-mechanical polishing (CMP) at a speed of no more than 100 nm/h to remove the surface in a thickness of 100 nm or greater, and produce no more than 1 approximately circular pit per cm 2 , the pit having a diameter of 0.5-1.5 µm and a depth of 50-500 nm.
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