首页> 外国专利> Retaining ring with a reduced wear, - and of contamination for a polishing head of a cmp - plant and polishing head and cmp - device with a retainer ring

Retaining ring with a reduced wear, - and of contamination for a polishing head of a cmp - plant and polishing head and cmp - device with a retainer ring

机译:减少磨损的卡环-以及对cmp抛光头的污染-植物,抛光头和cmp-带有固定环的装置

摘要

Holding element for a polishing head, wherein the holding element an upper region (351) and a lower region (353), wherein the lower region (353) is formed from silicon carbide, and wherein, between the upper region (351) and the lower region (353) of an intermediate area (352) is provided with increased elasticity, while the intermediate region (352), an electrically conductive component or a flexible conductive element, and wherein the lower region (353) beyond the intermediate region (352) is electrically grounded, for deriving of charge carriers which, by means of friction are generated during the polishing.
机译:一种用于抛光头的保持元件,其中,所述保持元件包括上部区域(351)和下部区域(353),其中所述下部区域(353)由碳化硅形成,并且其中,在所述上部区域(351)和所述下部区域之间。中间区域(352)的下部区域(353)具有增加的弹性,而中间区域(352),导电部件或柔性导电元件,并且其中下部区域(353)超出中间区域(352)电接地)以导出电荷载体,该电荷载体在抛光过程中通过摩擦产生。

著录项

  • 公开/公告号DE10261306B4

    专利类型

  • 公开/公告日2010-02-25

    原文格式PDF

  • 申请/专利权人

    申请/专利号DE2002161306

  • 发明设计人

    申请日2002-12-27

  • 分类号H01L21/302;

  • 国家 DE

  • 入库时间 2022-08-21 18:29:10

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