Method for singling, which are combined to form a group, a plastic encapsulation body pin-count chip packages having

摘要

A method for singulating a group of semiconductor packages containing a plastic molded body. The singulation of the semiconductor packages is effected along a predetermined separation area, wherein, in the predetermined separation area, a metallic layer extending over at least a partial section of the predetermined separation area has to be cut through in addition to a plastic layer formed of a material of the molded body. The method includes the steps of: making a groove into the predetermined separation area of the semiconductor packages by laser engraving, wherein at least a part of the metallic layer extending in the predetermined singulation area is removed, and subsequent separation of the semiconductor packages by mechanical sawing cut along the predetermined separation area.