The present invention relates to a melt - or - reflow soldering process, the no evaporation of the flux agent was part in the direction of the atmospheric gas, and thereby avoids a variety of problems by the evaporation of the in the solder paste flux contained in the atmospheric gas and the subsequent solidification of this flow means was parts. The inventive reflow - soldering process in this case has the following steps:Conveying and insertion of a workpiece for the solder reflow apparatus in a closable treatment chamber; closing the treatment chamber; introduction of inert gas into the treatment chamber, which is under a pressure which is higher than the saturation vapour pressure of the contained in the solder on the workpiece in the case of soldering flux adhering means melting temperature; maintaining the treatment chamber to a pressure which is higher than the saturation vapour pressure, while the workpiece is heated to melt soldering temperature, and the temperature of the workpiece is kept constant; melting of the in the case of the previous step on the workpiece for the solder adhering solder reflow apparatus.
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