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- A semi conductor gan device and method using the gan on a thin layer of sapphire filed on a substrate of polycrystalline silicon carbide

机译:-在多晶碳化硅衬底上锉成的蓝宝石薄层上使用gan的半导体gan器件和方法

摘要

Substrate has a polycrystalline silicon carbide disk comprising parallel upper and lower surfaces with a given thickness. A thin sapphire layer (11) is provided above the upper surface of the substrate. The layer has a thickness greater than 0.1 micron. Upper surface of the layer (11) receives layers of a gallium nitride based semi-conductor device having a relatively thick gallium nitride layer. A series of layers (20) e.g. aluminum nitride transition layer, is developed on the layer (11). A gallium nitride type layer is grown above the layer (11) with a transition layer. An independent claim is also included for a method for manufacturing a nitride-III heterojunction device.
机译:基板具有包括给定厚度的平行上表面和下表面的多晶碳化硅盘。在衬底的上表面上方提供薄的蓝宝石层(11)。该层的厚度大于0.1微米。层(11)的上表面容纳具有相对较厚的氮化镓层的基于氮化镓的半导体器件的层。一系列层(20),例如在层(11)上显影氮化铝过渡层。在具有过渡层的层(11)上方生长氮化镓类层。还包括用于制造氮化物-III异质结器件的方法的独立权利要求。

著录项

  • 公开/公告号FR2896090B1

    专利类型

  • 公开/公告日2010-05-14

    原文格式PDF

  • 申请/专利权人 INTERNATIONAL RECTIFIER CORPORATION;

    申请/专利号FR20070000243

  • 发明设计人 DANIEL M KINZER;

    申请日2007-01-12

  • 分类号H01L21/20;H01L21/336;

  • 国家 FR

  • 入库时间 2022-08-21 18:26:57

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