首页> 外国专利> Fabricating semiconductor material, which is useful in field of photovoltaics, electronics or microelectronics from starting material, comprises reducing starting material to powder form, and sintering powders by heat or cold compression

Fabricating semiconductor material, which is useful in field of photovoltaics, electronics or microelectronics from starting material, comprises reducing starting material to powder form, and sintering powders by heat or cold compression

机译:由起始材料制造可用于光伏,电子或微电子领域的半导体材料,包括将起始材料还原成粉末形式,以及通过加热或冷压烧结粉末

摘要

The process of fabricating a semiconductor material from a starting material, comprises reducing the starting material to powder form if it is not present in powder form, sintering the powders (12) by heat or cold compression and heat treatment, and purifying the material using an inert gas flow traversing the material through porous channels interconnected with the material. The gas is a mixture formed of inert carrier gas and a reactive gas, where the reactive gas reacts with impurities of the material for forming a volatile compound. The process of fabricating a semiconductor material from a starting material, comprises reducing the starting material to powder form if it is not present in powder form, sintering the powders (12) by heat or cold compression and heat treatment, and purifying the material using an inert gas flow traversing the material through porous channels interconnected with the material. The gas is a mixture formed of inert carrier gas and a reactive gas, where the reactive gas reacts with impurities of the material for forming a volatile compound directed towards outside of the material by flow of gas. The flow of gas is obtained by pumping with a pressure of 1 hectopascal to atmospheric pressure, or a pressure of greater than the atmospheric pressure. The purification step is carried out at a same time of heat treatment of the material.
机译:由起始材料制造半导体材料的过程包括:如果起始材料不以粉末形式存在,则将其还原成粉末形式;通过加热或冷压缩和热处理烧结粉末(12);以及使用惰性气体流穿过与材料互连的多孔通道穿过材料。该气体是由惰性载气和反应性气体形成的混合物,其中反应性气体与材料的杂质反应以形成挥发性化合物。由起始材料制造半导体材料的方法包括:如果起始材料不以粉末形式存在,则将其还原成粉末形式;通过加热或冷压缩和热处理烧结粉末(12);以及使用惰性气体流穿过与材料互连的多孔通道穿过材料。所述气体是由惰性载气和反应性气体形成的混合物,其中所述反应性气体与所述材料的杂质反应,以形成通过气体流引向所述材料外部的挥发性化合物。通过以1百帕斯卡的压力泵至大气压力或大于大气压力的压力来获得气流。纯化步骤在材料热处理的同时进行。

著录项

  • 公开/公告号FR2934186A1

    专利类型

  • 公开/公告日2010-01-29

    原文格式PDF

  • 申请/专利权人 STILE;

    申请/专利号FR20080055149

  • 发明设计人 STRABONI ALAIN;

    申请日2008-07-28

  • 分类号B22F3/24;C01B33;C30B31/06;H01L29/16;H01L31/028;H01L31/04;

  • 国家 FR

  • 入库时间 2022-08-21 18:26:45

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