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Package substrate or device using a buried layer of dielectric material can be switched by voltage in the vertical switching configurations
Package substrate or device using a buried layer of dielectric material can be switched by voltage in the vertical switching configurations
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机译:在垂直开关配置中,可以通过电压来开关使用介电材料埋层的封装基板或器件
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摘要
A substrate device includes an embedded layer of VSD material that overlays a conductive element or layer to provide a ground. An electrode, connected to circuit elements that are to be protected, extends into the thickness of the substrate to make contact with the VSD layer. When the circuit elements are operated under normal voltages, the VSD layer is dielectric and not connected to ground. When a transient electrical event occurs on the circuit elements, the VSD layer switches instantly to a conductive state, so that the first electrode is connected to ground.
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