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SUBSTRATE DEVICE OR PACKAGE USING EMBEDDED LAYER OF VOLTAGE SWITCHABLE DIELECTRIC MATERIAL IN A VERTICAL SWITCHING CONFIGURATION
SUBSTRATE DEVICE OR PACKAGE USING EMBEDDED LAYER OF VOLTAGE SWITCHABLE DIELECTRIC MATERIAL IN A VERTICAL SWITCHING CONFIGURATION
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机译:在垂直切换配置中使用电压可切换介电材料的嵌入式层的基板设备或封装
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摘要
substrate layer that provides a grounding device 240 or the conductive material above the VSD device 230 includes an embedded layer . Electrode 210 is connected to the circuit protection device will not be brought into contact with the VSD layer extending into the thickness of the substrate . If the circuit element is working under normal voltage , VSD layer is a dielectric , but not connected to ground . If you experience a temporary electrical phenomenon on the circuit element , VSD layer is immediately switched to the conductive state connected to the first electrode is grounded . ;
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