首页> 外国专利> SUBSTRATE DEVICE OR PACKAGE USING EMBEDDED LAYER OF VOLTAGE SWITCHABLE DIELECTRIC MATERIAL IN A VERTICAL SWITCHING CONFIGURATION

SUBSTRATE DEVICE OR PACKAGE USING EMBEDDED LAYER OF VOLTAGE SWITCHABLE DIELECTRIC MATERIAL IN A VERTICAL SWITCHING CONFIGURATION

机译:在垂直切换配置中使用电压可切换介电材料的嵌入式层的基板设备或封装

摘要

A substrate device includes an embedded layer of VSD material that overlays a conductive element or layer to provide a ground. An electrode, connected to circuit elements that are to be protected, extends into the thickness of the substrate to make contact with the VSD layer. When the circuit elements are operated under normal voltages, the VSD layer is dielectric and not connected to ground. When a transient electrical event occurs on the circuit elements, the VSD layer switches instantly to a conductive state, so that the first electrode is connected to ground.
机译:衬底装置包括VSD材料的嵌入层,该VSD材料的嵌入层覆盖导电元件或导电层以提供接地。连接到要保护的电路元件的电极延伸到基板的厚度以与VSD层接触。当电路元件在正常电压下工作时,VSD层是绝缘的,不接地。当电路元件上发生瞬态电事件时,VSD层立即切换到导电状态,因此第一电极接地。

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