Wire bonding apparatus, bonding tool exchange method and program for wire bonding apparatus

摘要

A wire bonding apparatus, a method of exchanging a bonding tool of the same, and a computer readable record medium are provided to continuously perform bonding process while exchanging a bonding tool during the bonding process. A bonding arm(13) has a chuck(18a) installed on a front end thereof for holding a bonding tool which is moved to or from a bonding surface in an arc manner. The chuck is opened and closed by a chuck opening/closing unit. A bonding tool attaching/detaching unit(31) has a holding part(31a) holding the bonding tool and a driving part linearly moving the holding part in an axial direction of the chuck. The bonding tool attaching/detaching unit attaches or detaches the bonding tool to or from the chuck in cooperation with the chuck opening/closing unit.