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Less sputtering target of particle generation, equipment and roughening method of backing plate or sputtering apparatus
Less sputtering target of particle generation, equipment and roughening method of backing plate or sputtering apparatus
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机译:颗粒产生的溅射靶较少,背板或溅射装置的设备和粗糙化方法
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摘要
PROBLEM TO BE SOLVED: To provide a sputtering target, a backing plate and an instrument in a sputtering device capable of preventing the peeling and scattering of deposit generated from the surface of the target, the backing plate and the instrument in the sputtering device, to which an unnecessary film is deposited, and to provide a roughening method using an electron discharge machining.;SOLUTION: In the sputtering target, the backing plate and the instrument in the sputtering device, an electron discharge trace is formed on the surface where the unnecessary film is deposited during sputtering, and the electron discharge trace is composed of many inclined protrusions having an inclination of less than 90°.;COPYRIGHT: (C)2009,JPO&INPIT
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