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Less sputtering target of particle generation, equipment and roughening method of backing plate or sputtering apparatus

机译:颗粒产生的溅射靶较少,背板或溅射装置的设备和粗糙化方法

摘要

PROBLEM TO BE SOLVED: To provide a sputtering target, a backing plate and an instrument in a sputtering device capable of preventing the peeling and scattering of deposit generated from the surface of the target, the backing plate and the instrument in the sputtering device, to which an unnecessary film is deposited, and to provide a roughening method using an electron discharge machining.;SOLUTION: In the sputtering target, the backing plate and the instrument in the sputtering device, an electron discharge trace is formed on the surface where the unnecessary film is deposited during sputtering, and the electron discharge trace is composed of many inclined protrusions having an inclination of less than 90°.;COPYRIGHT: (C)2009,JPO&INPIT
机译:解决的问题:在溅射装置中提供溅射靶,背板和仪器,以防止从靶表面,背板和仪器的表面产生的沉积物剥落和散射,解决方法:在溅射靶材,溅射装置中的背板和仪器中,在不需要的表面上形成电子放电痕迹溅射过程中会沉积成膜,电子放电轨迹由许多倾斜度小于90°的倾斜突起组成。版权所有:(C)2009,JPO&INPIT

著录项

  • 公开/公告号JP4739368B2

    专利类型

  • 公开/公告日2011-08-03

    原文格式PDF

  • 申请/专利权人 JX日鉱日石金属株式会社;

    申请/专利号JP20080124193

  • 发明设计人 高橋 秀行;

    申请日2008-05-12

  • 分类号C23C14/00;C23C14/34;B23H1/00;B23H9/00;

  • 国家 JP

  • 入库时间 2022-08-21 18:19:08

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