And a method of manufacturing the semiconductor device including a cell transistor having a recess channel structure

摘要

A method of manufacturing a semiconductor device is provided. Device separation portions defining first, second and third regions are formed in a substrate. A recess is formed at the first region. An N-type well is formed at the third region. An N-type polysilicon layer is formed at the first and second regions. A P-type polysilicon layer is formed at the third region. At least one of metal silicide film and a metal film is formed on the N-type polysilicon layer and the P-type polysilicon layer. Etching is performed to form a gate electrode including the N-type polysilicon layer at the first and second regions and a gate electrode including the P-type polysilicon layer at the third region. A cell transistor having a recess channel structure is formed at the first region, an nMOSFET structure is formed at the second region, and a pMOSFET structure is formed at the third region.