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Tip/chip on-board method and tip/chip on-board device

机译:尖端/芯片车载方法和尖端/芯片车载装置

摘要

As tip/chip retention expedient (12) the tip/chip which is mounted on (2) tip/chip surface recognition expedient (13) and tip/chip underside recognition expedient (9) with you recognize the alignment mark of surface side and underside side, you remember the relative position relationship of the mark which is recognized, to the baseplate (3) the bonding head (6) convey the tip/chip (2) to position for loading and it makes adsorb make keep to the said bonding head (6), the tip/chip (2) loading in the baseplate before (3), before the loading you recognize the underside side alignment mark of the tip/chip with tip/chip underside recognition expedient, the alignment mark of the baseplate before the loading with baseplate recognition expedientYou recognize, tip/chip underside recognition expedient and before the loading forming tip/chip underside recognition expedient with portable possible identical recognition expedient doing the alignment of the tip/chip and the baseplate in standard, in the method of loading the tip/chip onto the baseplate on the basis of the relationship of the above-mentioned relative position which is remembered, the surface side alignment mark of the tip/chip, you offer tip/chip on-board method and the device which it tries to prevent the occurrence of the alignment error which originates in the difference of resolution when recognition expedient differs.
机译:作为笔尖/切屑保留权柄(12),安装在(2)笔尖/切屑表面识别权柄(13)和笔尖/切屑底侧识别权柄(9)上的笔尖/切屑可识别表面侧和底侧的对准标记侧面,您还记得被识别的标记相对于基板(3)的相对位置关系,粘合头(6)将尖端/芯片(2)传送到要加载的位置,并使吸附保持在该粘合头上(6),将尖端/切屑(2)装入基板之前(3),在装载之前您已识别出尖端/切屑的下侧对准标记且具有尖端/切屑的下侧识别权,之前的基板对准标记使用底板识别权宜的载荷您识别,尖端/切屑下侧识别权宜,并且在装载之前使用便携式可能的相同识别权宜方法形成尖端/芯片下侧识别权宜,在标准情况下将尖端/切屑与底板对齐根据记住的上述相对位置,烙铁头/切屑的表面对准标记的关系,将烙铁头/切屑装载到底板上的方法,您提供烙铁头/切屑的车载方法和当识别权宜时,它试图防止由于分辨率的差异而引起的对准误差的发生。

著录项

  • 公开/公告号JPWO2009096454A1

    专利类型

  • 公开/公告日2011-05-26

    原文格式PDF

  • 申请/专利权人 東レエンジニアリング株式会社;

    申请/专利号JP20090551555

  • 发明设计人 寺田 勝美;

    申请日2009-01-29

  • 分类号H01L21/52;

  • 国家 JP

  • 入库时间 2022-08-21 18:16:59

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