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SYSTEM AND METHOD FOR CALIBRATING A WAFER HANDLING ROBOT AND A WAFER CASSETTE
SYSTEM AND METHOD FOR CALIBRATING A WAFER HANDLING ROBOT AND A WAFER CASSETTE
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机译:校准晶片处理机器人和晶片盒的系统和方法
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摘要
A system and method is disclosed for calibrating a semiconductor wafer handling robot and a semiconductor wafer cassette. A robot blade boot is attached to a robot blade of the semiconductor handling robot. The robot blade boot decreases a value of tolerance for the robot blade to move between two semiconductor wafers in the semiconductor wafer cassette. In one embodiment the vertical tolerance is decreased to approximately twenty thousandths of an inch (0.020″) on a top and a bottom of the robot blade boot. The use of the robot blade boot makes the calibration steps more critical and precise. The robot blade boot is removed from the robot blade after the calibration process has been completed.
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