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INTEGRATED CIRCUITS MODELING MANUFACTURING PROCEDURE AND MANUFACTURING SYSTEM UTILIZING THE SAME
INTEGRATED CIRCUITS MODELING MANUFACTURING PROCEDURE AND MANUFACTURING SYSTEM UTILIZING THE SAME
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机译:集成电路建模制造过程和利用该模型的制造系统
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摘要
An ICs modeling manufacturing procedure is disclosed. A first pattern is printed on a first surface of a printed circuit board (PCB). The first pattern includes a first barcode and a plurality of production codes. A plurality of elements are disposed on the first surface of the PCB. The PCB is heated to fix the elements on the first surface and secure the first pattern on the first surface of the PCB. When the first pattern is read, a first production information is obtained.
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