首页>
外国专利>
Semiconductor Housing Package, Semiconductor Package Structure Including The Semiconductor Housing Package, And Processor-Based System Including The Semiconductor Package Structure
Semiconductor Housing Package, Semiconductor Package Structure Including The Semiconductor Housing Package, And Processor-Based System Including The Semiconductor Package Structure
展开▼
机译:半导体外壳封装,包括半导体外壳封装的半导体封装结构以及包括半导体封装结构的基于处理器的系统
展开▼
页面导航
摘要
著录项
相似文献
摘要
A semiconductor housing package may be provided. The semiconductor housing package may include a mold layer, a housing chip, a redistribution structure, and a housing node. The mold layer may surround and partially expose the housing chip. The redistribution structure may be electrically connected to the housing chip and may be disposed on the mold layer. The housing node may be in contact with the redistribution structures. The semiconductor housing package may be disposed on a semiconductor base package and may constitute a semiconductor package structure along with the semiconductor base package. The semiconductor package structure may be disposed on a processor-based system.
展开▼