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Semiconductor package, semiconductor package structure including the semiconductor package, and mobile phone including the semiconductor package structure
Semiconductor package, semiconductor package structure including the semiconductor package, and mobile phone including the semiconductor package structure
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机译:半导体封装,包括该半导体封装的半导体封装结构以及包括该半导体封装结构的移动电话
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摘要
Provided is a semiconductor package. The semiconductor package may include a first semiconductor package having first semiconductor chips sequentially stacked on a substrate. In example embodiments, the first semiconductor chips may have a cascaded arrangement in which first sides and second sides of the semiconductor chips define cascade patterns. The cascaded arrangement may extend in a first direction to define a space between the first sides of the first semiconductor chips and the substrate. The semiconductor package may also include at least one first connection wiring at the second sides of the semiconductor chips, the at least one first connection wiring being configured to electrically connect the substrate with the first semiconductor chips. In addition, the semiconductor package may further include a first filling auxiliary structure adjacent to the first sides of the first semiconductor chips.
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