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SEMICONDUCTOR HOUSING PACKAGE, SEMICONDUCTOR PACKAGE STRUCTURE COMPRISING THE SEMICONDUCTOR HOUSING PACKAGE AND PROCESSOR-BASED SYSTEM COMPRISING THE SEMICONDUCTOR PACKAGE STRUCTURE
SEMICONDUCTOR HOUSING PACKAGE, SEMICONDUCTOR PACKAGE STRUCTURE COMPRISING THE SEMICONDUCTOR HOUSING PACKAGE AND PROCESSOR-BASED SYSTEM COMPRISING THE SEMICONDUCTOR PACKAGE STRUCTURE
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机译:半导体外壳包,包含半导体外壳包的半导体包结构以及基于处理器的,包含半导体包结构的系统
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摘要
A semiconductor housing package may be provided. The semiconductor housing package may include a mold layer, a housing chip, a redistribution structure, and a housing node. The mold layer may surround and partially expose the housing chip. The redistribution structure may be electrically connected to the housing chip and may be disposed on the mold layer. The housing node may be in contact with the redistribution structures. The semiconductor housing package may be disposed on a semiconductor base package and may constitute a semiconductor package structure along with the semiconductor base package. The semiconductor package structure may be disposed on a processor-based system.
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