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Method of making thin film transistor with zinc oxide based semiconductor layer and zinc oxide based insulation layer

机译:具有基于氧化锌的半导体层和基于氧化锌的绝缘层的薄膜晶体管的制造方法

摘要

According to a method of fabricating an oxide thin-film transistor, when a thin-film transistor is fabricated by using an amorphous zinc oxide (ZnO)-based semiconductor as an active layer, it may be possible to reduce a tact time as well as attain an enhanced element characteristic by depositing an insulation layer having an oxide characteristic in-situ through controlling oxygen (O2) flow subsequent to depositing an oxide semiconductor using a sputter, and the method may include the steps of forming a gate electrode on a substrate; forming a gate insulation layer on the substrate; depositing an amorphous zinc oxide-based semiconductor layer made of an amorphous zinc oxide-based semiconductor and an amorphous zinc oxide-based insulation layer having an oxide characteristic in-situ on the gate insulation layer; forming an active layer made of the amorphous zinc oxide-based semiconductor over the gate electrode while at the same time forming a channel protection layer made of the amorphous zinc oxide-based insulation layer on a channel region of the active layer; and forming a source electrode and a drain electrode electrically connected to a source region and a drain region of the active layer over the active layer.
机译:根据制造氧化物薄膜晶体管的方法,当通过使用基于非晶氧化锌(ZnO)的半导体作为有源层来制造薄膜晶体管时,可以缩短节拍时间,并且在通过溅射沉积氧化物半导体之后,通过控制氧气(O 2 )的流动在原位沉积具有氧化物特性的绝缘层,从而获得增强的元素特性,该方法可以包括以下步骤:在基板上形成栅电极;在基板上形成栅极绝缘层;在栅极绝缘层上原位沉积由非晶态氧化锌基半导体制成的非晶态氧化锌基半导体层和具有氧化物特性的非晶态氧化锌基绝缘层;在栅电极上形成由非晶氧化锌基半导体制成的有源层,同时在有源层的沟道区上形成由非晶氧化锌基绝缘层制成的沟道保护层;在有源层上形成电连接到有源层的源区和漏区的源电极和漏电极。

著录项

  • 公开/公告号US7981720B2

    专利类型

  • 公开/公告日2011-07-19

    原文格式PDF

  • 申请/专利权人 DAE-WON KIM;JONG-UK BAE;

    申请/专利号US20090648872

  • 发明设计人 DAE-WON KIM;JONG-UK BAE;

    申请日2009-12-29

  • 分类号H01L21/00;H01L21/36;

  • 国家 US

  • 入库时间 2022-08-21 18:11:38

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