首页> 外国专利> ZINC OXIDE-BASED SPUTTERING TARGET, METHOD FOR MANUFACTURING ZINC OXIDE-BASED SPUTTERING TARGET, AND THIN FILM TRANSISTOR WITH SHIELDING LAYER DEPOSITED BY METHOD FOR MANUFACTURING ZINC OXIDE-BASED SPUTTERING TARGET

ZINC OXIDE-BASED SPUTTERING TARGET, METHOD FOR MANUFACTURING ZINC OXIDE-BASED SPUTTERING TARGET, AND THIN FILM TRANSISTOR WITH SHIELDING LAYER DEPOSITED BY METHOD FOR MANUFACTURING ZINC OXIDE-BASED SPUTTERING TARGET

机译:基于氧化锌的溅射靶材,制造基于氧化锌的溅射靶材的方法,以及具有通过制造基于氧化锌的溅射靶材的方法沉积的具有屏蔽层的薄膜晶体管

摘要

The present invention relates to a zinc oxide-based sputtering target, a method for manufacturing the zinc oxide-based sputtering target, and a thin film transistor with a shielding layer deposited by the method and, more specifically, to a zinc oxide-based sputtering target, a method for manufacturing the zinc oxide-based sputtering target, and a thin film transistor with a shielding layer deposited by the method capable of performing DC sputtering and increasing contacting and etching performances of the shielding layer deposited by the DC sputtering. The zinc oxide-based sputtering target comprises a sintered body which is made of zinc oxide doped with indium(III) oxide of 1-50 wt%; and a backing plate which is coupled to a rear surface of the sintered body to support the sintered body.;COPYRIGHT KIPO 2014
机译:氧化锌基溅射靶,其制造方法以及具有该方法沉积的具有屏蔽层的薄膜晶体管技术领域本发明涉及一种氧化锌基溅射靶,该氧化锌基溅射靶的制造方法以及具有通过该方法沉积的屏蔽层的薄膜晶体管,更具体地,涉及一种氧化锌基溅射。靶,用于制造基于氧化锌的溅射靶的方法,以及具有通过该方法沉积的屏蔽层的薄膜晶体管,该方法能够执行DC溅射并提高通过DC溅射沉积的屏蔽层的接触和蚀刻性能。氧化锌基溅射靶包括烧结体,该烧结体由掺杂有1〜50wt%的氧化铟(III)的氧化锌制成。 COPYRIGHT KIPO 2014;以及连接到烧结体后表面以支撑烧结体的背板。

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