首页> 外国专利> ZINC OXIDE-BASED SPUTTERING TARGET, METHOD OF MANUFACTURING THE SAME, AND THIN-FILM TRANSISTOR HAVING BARRIER LAYER DEPOSITED USING THE SAME

ZINC OXIDE-BASED SPUTTERING TARGET, METHOD OF MANUFACTURING THE SAME, AND THIN-FILM TRANSISTOR HAVING BARRIER LAYER DEPOSITED USING THE SAME

机译:基于氧化锌的溅射靶材,制造相同靶材的方法以及具有使用相同靶材沉积的阻挡层的薄膜晶体管

摘要

A zinc oxide (ZnO)-based sputtering target, a method of manufacturing the same, and a thin-film transistor (TFT) having a barrier layer deposited using the same. The zinc oxide-based sputtering target includes a sinter containing zinc oxide doped with gallium oxide, the content of the gallium oxide ranging, by weight, from 10 to 50 percent of the sinter, and a backing plate bonded to the rear surface of the sinter to support the sinter. The zinc oxide-based sputtering target can be subjected to direct current (DC) sputtering, and improve the contact and etching characteristics of a barrier layer that is deposited using the same.
机译:基于氧化锌(ZnO)的溅射靶,其制造方法以及具有使用其沉积的阻挡层的薄膜晶体管(TFT)。基于氧化锌的溅射靶包括:烧结体,其包含掺杂有氧化镓的氧化锌;氧化镓的含量按重量计为烧结体的10%至5​​0%;以及背板,其结合至烧结体的后表面。支持烧结矿。可以对基于氧化锌的溅射靶进行直流(DC)溅射,并改善使用该靶沉积的阻挡层的接触和蚀刻特性。

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