首页> 外国专利> RESIN COMPOSITION FOR NO-FLOW UNDERFILL, NO-FLOW UNDERFILL FLIM USING THE SAME AND MANUFACTURING METHOD THEREOF

RESIN COMPOSITION FOR NO-FLOW UNDERFILL, NO-FLOW UNDERFILL FLIM USING THE SAME AND MANUFACTURING METHOD THEREOF

机译:用于无流动下溢,无流动下溢薄膜的树脂组合物及其制造方法

摘要

Disclosed herein are a resin composition for no-flow underfill, which can be formed into a film, a no-flow underfill film formed from the composition and a manufacturing method of the no-flow underfill film. The resin composition for no-flow underfill has a viscosity higher than 500 cps which is suitable for coating on a film. Thus, the no-flow underfill composition can be manufactured into a laminatable film type without any additional additive. Accordingly, the resin composition makes it possible to accurately control the thickness and area of underfill, unlike the prior paste type composition.
机译:本文公开了可形成膜的用于不流动底部填充的树脂组合物,由该组合物形成的不流动底部填充膜和该不流动底部填充膜的制造方法。用于非流动性底部填充的树脂组合物的粘度高于500 cps,适用于涂在薄膜上。因此,无流动的底部填充组合物可以被制造成可层压的膜类型,而无需任何额外的添加剂。因此,与现有的糊状组合物不同,该树脂组合物使得可以精确地控制底部填充物的厚度和面积。

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